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Application Notes:
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Spectroscopic Ellipsometry |
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The telecommunications industry is growing larger than ever mainly due to the demand for faster information transfer. Fiber optic communication is rapidly becoming the backbone for voice, video, and internet data transfer. As this industry matures, the components for broadband fiber networking undergo continuous research and development. These components include VCSEL and edge-emitting lasers, thin-film DWDM filters and waveguides for multiplexing/demultiplexing, EDFA and Raman amplifiers, photodiode detectors, and more. Thin films are critical to the performance of these devices. Spectroscopic ellipsometry (SE) is uniquely suited to measure both film thickness and refractive index at telecom wavelengths in the infrared. This article surveys both ex situ and in situ SE applied to the single and multilayer film structures of telecom devices. Transmitters and Receivers A. Laser Sources Semiconductor lasers create light via optical transitions between energy levels in a direct-bandgap semiconducting film. Ternary and quaternary alloy semiconductors offer the |
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![]() Figure 1: Changes in AlxGa1-xAs with alloy ratio, x. |
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Spectroscopic Ellipsometry |
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![]() Figure 2: Data and fits for bi-layer compound semiconductor. |
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In most cases, a single layer film is used to determine the alloy ratio from a process. However, in situ ellipsometry is used to monitor the alloy ratio during film deposition. In situ ellipsometry has also been used for real-time feedback control of different processes. The typical laser diode structure can be very complex and consist of hundreds of layers. In this case, it can be difficult to monitor each and every layer. |
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| Recent investigations by Schubert have demon- strated the capabilities of mid- to far- infrared ellipsometry for laser diode and LED structures. Although the final structure is very complicated (Figure 3a shows Schubert’s model for a laser diode) and can consist of 100’s of thin semiconductor layers, infrared ellipsometry has shown sensitivity to carrier concentration and mobility, layer thickness, composition, strain, and crystal quality. In this case, the infrared wavelengths are much larger than the individual layer features, so SE senses the overall effect of the structure without requiring an exact description of each layer. ![]() |
![]() Figure 3a: Model for Laser Diode structure. Figure 3b: Data fit for Laser Diode structure. |
Film thickness for a semiconductor layer can also be a critical parameter. Spectroscopic ellipsometry measures the interference pattern created from multiple reflections of the probe-light within the layer. Thus, no thickness information is available from ellipsometry if the film is absorbing. The lightmust be allowed to reach the bottom of the film and return to the surface to determine thickness. The low-bandgap semiconductors used in infrared detectors will absorb over most conventional ellipsometer wavelengths. For instance, an InGaAs film thickness would not be measurable using commercial ellipsometry out to 1.7µm, as its bandgap is very near the longest wavelength of this instrument. New extended range detectors are being implemented in SE to overcome this limitation. VASE measurements with a new extended-range detector are shown in Figure 4 from a thick InGaAs film. This fit result provides an accurate thickness for the film that would not be available from conventional ellipsometry out to 1.7µm (shown in yellow). |
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![]() Figure 4: InGaAs (a) data and (b) resulting optical constants using an extended NIR detector (traditional SE range shown in yellow). |
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References: 1. VCSEL Vertical Cavity Surface Emitting Laser 2. DWDM Dense Wavelength Division Multiplexing 3. EDFA Erbium Doped Fiber Amplifiers 4. Amnon Yariv, Optical Electronics, 4 Edition, Saunders College Publishing, Philadelphia, (1991) p 565. 5. P.G. Snyder, et al. “Modeling AlxGa1-xAs optical constants as functions of composition,” J. Appl. Phys. 68 11 (1990), 5925. 6. B. Johs, J. Hale, J. Hilfiker, “Real-time process control with in situ spectroscopic ellipsometry,” III-Vs Review, 10 5 (1997) 40-42. 7. LED Light Emitting Diode 8. M Schubert, et al. SPIE Proc., 4449-8 (2001). |
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